| Engineering Services |  | Sub Contract Manufacturing | | Semiconductor Test Equipment |
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Laser Diode Test | |
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The AmFax range of Laser Diode Test Systems are based on the principle of maximising test through-put and minimising handling damage. The implementation of functional test instruments and techniques from Keithley Instruments provides a tried and trusted measurement solution but handling damage and low throughput makes laser diode (or any similarly fragile semi-conductor device) test a costly. The AmFax solutions use proprietary handling and robotics technology to overcome these issues. We are able to test semi-conductor devices in any format; including a strip (or Bar) of multiple devices, individual die (chip) and Chip on Carrier (CoC). |
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The test system; COTS instruments, Power Supplies etc. are integrated below the robot table, as close as possible to the active test head. This enables extremely stable and repeatable measurements, tight control of test head temperatures and provides a neatly enclosed system. The physical design of the platform is based on the SMEMA standard, which allows for easy integration into fully automated, conveyor based systems. To reduce costs the handling platform is based upon the Epson SCARA type robot, providing 20um accuracy out of the box. Due to the extreme tolerances required by optical component test it is often necessary to integrate a vision guidance system that provides the operator with the ability to calibrate the positional accuracy and achieve <2um repeatability while maintaining motion speed. Something that would cost many hundreds of thousands of Dollars otherwise. The accuracy of our pick and place techniques provide a very stable platform for auto-alignment of the receiving fibre. This improves alignment time from 10's of seconds down to just a few seconds, in many applications. | |
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AmFax proprietary end effector, probing and test head technology complete the platform, items that are designed to meet the requirements of the application and achieve very accurate UUT placement, probing accuracy, temperature control and zero handling damage. The yield from the parent wafer can now also be measured accurately and enables process improvements to further improve yield and throughput. |
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The options available for fragile component measurement and handling are numerous and one of our engineers would be pleased to discuss this with you. Please contact AmFax to discuss your application. | |
| © AmFax Ltd. 17/4/2008 Tel: +44 (0) 1258 480777. The web site is subject to continuous development and will regularly be updated. All links were live at the time of posting, but it is the nature of the web that some will disappear as they grow older. Please report any errors or omissions to: |
